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UID:submissions.supercomputing.org_SC25_sess553_job212@linklings.com
SUMMARY:Senior Package Layout Engineer
DESCRIPTION:Arm has a great opportunity for a Senior Package Layout Engine
 er in our System-in-Package team! This Engineer will be part of a team res
 ponsible for implementing ARM’s next generation of SoC’s in the IoT, Autom
 otive, and Compute spaces. These complex designs use current and emerging 
 2.5 and 3D technologies and will require you to work closely with IP, PCB,
  SI/PI and Systems teams in France, US, UK, and other ARM locations as nee
 ded as well as our technology partners.\n\nThe engineer will assist in the
  definition, design, and verification of our package designs. The candidat
 e needs to be able to adapt quickly to loosely defined problems and adapt 
 to changes is important.\n\nLayouts using best-known practices for DFM, DF
 A, Signal and Power Delivery Networks\nWork with minimal supervision and a
 pproach challenges with enthusiasm and persistence\nBring forward ideas to
  improve overall team efficiency\nCommunicate and coordinate with external
  vendors as necessary\n\nRegistration Category: Technical Program Reg Pass
 , Workshop Reg Pass, Tutorial Reg Pass, Exhibits Reg Pass\n\nCountry: Unit
 ed States of America\n\nCompany: ARM\n\nIn-Person / Remote: In-person\n\nP
 art Time / Full Time: Full Time\n\nPosition Type: Permanent\n\n
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