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DTSTART;TZID=America/Chicago:20251120T163000
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UID:submissions.supercomputing.org_SC25_sess493_exforum116@linklings.com
SUMMARY:From Legacy to Next-Gen Optics: Air, Liquid, Immersion — Rethink, 
 Reassess, Redefine
DESCRIPTION:Peter Liu (Formerica OptoElectronics)\n\nAs AI workloads conti
 nue to demand the latest and most powerful GPUs, the TDP (thermal design p
 ower) is pushing data center thermal management toward the limits of conve
 ntional cooling technologies. Advanced thermal management for AI clusters,
  such as liquid cooling/direct-to-chip with cold plates and next-gen therm
 al management technology, such as immersion liquid cooling, may require ne
 w types of optical connectivity solutions for the next wave of infrastruct
 ure.\n\nThis session will examine why the shift to next-generation optics 
 is no longer optional but essential. We will highlight how today’s data ce
 nter thermal management solutions are increasingly hybrid, utilizing vario
 us cooling solutions that can operate seamlessly in air, liquid, and immer
 sion systems. The discussion will demonstrate how sealed optical cables me
 et the infrastructure of the future.\n\nAttendees will gain insights into 
 how sealed optical cables are evaluated for reliability and performance, s
 uch as material compatibility, mean time between failures (MTBF), and sign
 al integrity. These factors directly influence reliability, scalability, a
 nd cost efficiency in high-performance environments.\n\nNext-generation op
 tical connectivity solutions should be viewed as strategic enablers that f
 uture-proof an infrastructure from becoming the weakest link, providing a 
 foundation for growth, adaptability, and resilience in the era of AI-drive
 n data centers.\n\nTag: Networking\n\nRecording: Livestreamed, Recorded\n\
 nRegistration Category: Technical Program Reg Pass, Exhibits Reg Pass\n\nS
 ession Chair: Rupak Biswas (NASA)\n\n
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