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UID:submissions.supercomputing.org_SC25_sess190@linklings.com
SUMMARY:Hardware and Architecture
DESCRIPTION:Next Vector Project Based on Proven NEC Vector and RISC-V Arch
 itecture\n\nThe Next Vector Project by NEC addresses the growing challenge
 s in high performance computing (HPC), such as energy efficiency, scalabil
 ity, and accessibility. Building on the proven SX-Aurora TSUBASA vector ar
 chitecture, the project integrates the open-standard RISC-V instruction se
 t to foster inno...\n\n\nMasashi Ikuta and Shintaro Momose (NEC Corporatio
 n)\n---------------------\nCreating Connector Solutions for High-Power App
 lications\n\nBy 2030, data center power demand is projected to rise by 165
 %, with a 50% increase anticipated by 2027 alone—fueled by AI workloads an
 d exponential cloud growth. Meeting this demand isn’t just a matter of add
 ing more power capacity; it requires a fundamental reimagining of how that
  powe...\n\n\nWill Stewart (HARTING)\n---------------------\nGlobal TCO An
 alysis of Non-CDU Liquid Cooling\n\nDespite the extraordinary heat dissipa
 tion potential that liquid cooling provides to microprocessors, the global
  demand for compute performance has already surpassed the capabilities of 
 entry-level liquid cooling technologies due to the compounding challenge o
 f higher heat flux coinciding with lower...\n\n\nAustin Shelnutt and Tyler
  Duncan (Strategic Thermal Labs (STL))\n\nTag: Hardware and Architecture\n
 \nRecording: Livestreamed, Recorded\n\nRegistration Category: Technical Pr
 ogram Reg Pass, Exhibits Reg Pass\n\nSession Chair: Mark Feit (Internet2)
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