Presenter

Mark Steinke is a principal thermal architect at NVIDIA focused on cooling technologies for the Data Center GPU product lines. Prior to joining NVIDIA, he was the thermal architect who developed the first exascale supercomputer while at HPE/Cray, with his thermal design utilized in seven of the top 10 supercomputers in the world. He also developed both air-cooled and direct liquid-cooled solutions for ultra-dense and HPC servers at Lenovo and IBM.

Mark received a PhD at Rochester Institute of Technology while focusing on advanced liquid cooling for high-powered microelectronics by utilizing silicon microstructures and microchannels. He has over 50 patents and 30 publications focused on microelectronics cooling. Mark is an active contributor to ASHRAE, serving as Technical Committee (TC) 9.9 chair, voting member, and member of the TC9.9 IT subcommittee. Mark continues to focus on advanced cooling methods and energy efficiency for high-power electronics.