Presentation
The Cool Factor: Rising Above the Heated Innovation Race
DescriptionThis panel discussion will focus on how both the legacy and the next-gen tech of supercomputing pioneers enables future applications (such as cloud HPC, GenAI, etc.).
The interactive panel will recount the evolution of liquid cooling in supercompute and the decades of research, expertise, and lessons learned that have now, in turn, enabled the rapid deployment of liquid cooling for AI.
Leveraging industry knowledge and hand-on experience, the panel will share best practices for those looking to introduce liquid into application, and views on risks and opportunities for the future.
Panelists will provide insight into their learnings; "hot takes" on where technology is heading—including future requirements in terms of performance and reliability; and advice for attendees on how to overcome tomorrow's challenges for success at scale.
The interactive panel will recount the evolution of liquid cooling in supercompute and the decades of research, expertise, and lessons learned that have now, in turn, enabled the rapid deployment of liquid cooling for AI.
Leveraging industry knowledge and hand-on experience, the panel will share best practices for those looking to introduce liquid into application, and views on risks and opportunities for the future.
Panelists will provide insight into their learnings; "hot takes" on where technology is heading—including future requirements in terms of performance and reliability; and advice for attendees on how to overcome tomorrow's challenges for success at scale.
Event Type
Panel
TimeFriday, 21 November 20258:30am - 10:00am CST
Location240-241-242
Livestreamed
Recorded
Archive
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