Presentation
Systematic Thermal Analysis of Two-Phase Direct-to-Chip Cooling: A Framework for Efficient Data Center Thermal Design
SessionSoftware Tools
DescriptionAs HPC systems scale to meet AI workloads, processor power densities are increasing beyond 1,000 W. Two-phase (2P) direct-to-chip (DTC) cooling offers a high-efficiency, reliable, and future-proof alternative to traditional air or single-phase liquid cooling. This talk presents a comprehensive system-level thermal analysis for 2P DTC cooling, breaking down the end-to-end temperature difference (from processor case temperature to facility water supply temperature) into three contributing thermal resistances: cold plate, vapor line pressure drop, and condenser. Each of the contributions are analyzed quantitatively for two different refrigerants: R1233zd(E) and R515B. The thermal stack-up for 2P DTC cooling is compared with single-phase DTC cooling, showing that 2P systems support higher allowable facility water temperatures with high power/heat flux processors, enabling improved energy efficiency. This presentation offers HPC system architects and thermal engineers insights into benchmarking, optimizing, and deploying 2P cooling technologies to meet the thermal challenges of AI and exascale computing.
Event Type
Exhibitor Forum
TimeWednesday, 19 November 202511:30am - 12:00pm CST
Location130