Presentation
Global TCO Analysis of Non-CDU Liquid Cooling
SessionHardware and Architecture
DescriptionDespite the extraordinary heat dissipation potential that liquid cooling provides to microprocessors, the global demand for compute performance has already surpassed the capabilities of entry-level liquid cooling technologies due to the compounding challenge of higher heat flux coinciding with lower allowable processor temperatures. The response has been a growing effort to decrease facility water temperatures using historically inefficient methods such as mechanical chillers. As processor thermal resistance targets plummet, the coolant distribution unit (CDU) is quickly becoming a significant contributor to the temperature drop between the chip and facility water. Strategic Thermal Labs teamed up with a North American hyperscaler to perform a detailed datacenter cooling analysis to provide insight on the capital and operational expense reduction that is possible through elimination of CDUs in various global climates. Furthermore, discussion is provided on the viability of merging the FWS and TCS water loops at scale.
Event Type
Exhibitor Forum
TimeThursday, 20 November 202511:00am - 11:30am CST
Location130
Hardware and Architecture
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