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From Legacy to Next-Gen Optics: Air, Liquid, Immersion — Rethink, Reassess, Redefine
SessionNetworking
DescriptionAs AI workloads continue to demand the latest and most powerful GPUs, the TDP (thermal design power) is pushing data center thermal management toward the limits of conventional cooling technologies. Advanced thermal management for AI clusters, such as liquid cooling/direct-to-chip with cold plates and next-gen thermal management technology, such as immersion liquid cooling, may require new types of optical connectivity solutions for the next wave of infrastructure.
This session will examine why the shift to next-generation optics is no longer optional but essential. We will highlight how today’s data center thermal management solutions are increasingly hybrid, utilizing various cooling solutions that can operate seamlessly in air, liquid, and immersion systems. The discussion will demonstrate how sealed optical cables meet the infrastructure of the future.
Attendees will gain insights into how sealed optical cables are evaluated for reliability and performance, such as material compatibility, mean time between failures (MTBF), and signal integrity. These factors directly influence reliability, scalability, and cost efficiency in high-performance environments.
Next-generation optical connectivity solutions should be viewed as strategic enablers that future-proof an infrastructure from becoming the weakest link, providing a foundation for growth, adaptability, and resilience in the era of AI-driven data centers.
This session will examine why the shift to next-generation optics is no longer optional but essential. We will highlight how today’s data center thermal management solutions are increasingly hybrid, utilizing various cooling solutions that can operate seamlessly in air, liquid, and immersion systems. The discussion will demonstrate how sealed optical cables meet the infrastructure of the future.
Attendees will gain insights into how sealed optical cables are evaluated for reliability and performance, such as material compatibility, mean time between failures (MTBF), and signal integrity. These factors directly influence reliability, scalability, and cost efficiency in high-performance environments.
Next-generation optical connectivity solutions should be viewed as strategic enablers that future-proof an infrastructure from becoming the weakest link, providing a foundation for growth, adaptability, and resilience in the era of AI-driven data centers.
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